Intel has planned to release a new version of the Universal Serial Bus (USB) technology. Intel along with other leaders in the industry such as HP, Microsoft, NEC Corporation, NXP Semiconductors and Texas Instruments have formed the USB 3.0 Promoter Group to create a super speed personal USB interconnect that is capable of delivering over 10 times the speed of today’s connection.
The new USB 3.0 technology has been developed to replace the presently used and most ubiquitous USB 2.0 technology. This delivers fast sync-and-go transfer applications in the PC, consumer and mobile segments.
With the USB 3.0 technology, you can experience 4.8 gigabits per second of data-transfer rate, which is ten times more than the current USB 2.0 version delivering 480 megabits per second.
“USB 3.0 is the next logical step for the PC’s most popular wired connectivity. The digital era requires high-speed performance and reliable connectivity to move the enormous amounts of digital content now present in everyday life. USB 3.0 will meet this challenge while maintaining the ease-of-use experience that users have come to love and expect from any USB technology,†said Jeff Ravencraft, technology strategist with Intel and president of the USB Implementers Forum (USB-IF).
With this technology, it has improvised the protocol efficiency and optimized low power. The company has designed the USB 3.0 whose port and cabling are backward compatible as well as offer future-proofing for optical capabilities.
The Superspeed USB 3.0 technology is expected to roll out in the first half of 2008 by Intel, HP, Microsoft and others.
