Samsung has announced that it is starting mass production of eMCP (embedded multi-chip package) memory systems which can be used in smartphones featuring under entry- to mid-level categories. Available in varying densities, these chips are primarily aimed at the growing smartphone market, of course.
The Samsung hardware uses LPDDR2 DRAM made with 30 nanometer class process technology as well as NAND flash memory using 20 nanometer class processes. Apart from providing manufacturers with a simpler and more effective design solution, the chips are also said to help the concerned handsets to deliver better performance while saving on battery as well.
“As the need is growing for more advanced software and increased data storage in smartphones and tablets, mobile device makers are expected to introduce embedded memory solutions throughout 2012 that offer higher performance and density,†commented Myungho Kim, vice president of memory marketing, Device Solutions, Samsung Electronics. “Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of eMCP solutions in 2012.â€
These multi-chip packages are composed of a 4GB e-MMC (Embedded MultiMediaCard) centered on the 20 nanometer class NAND flash memory for data storage. To efficiently support high performance devices, choices like 256MB, 512MB or 768MB of 30 nanometer class LPDDR2 DRAM will also be made available. The 30 nanometer class LPDDR2 DRAM is said to offer a data transmission speed of up to 1,066Mbps.
Samsung has not disclosed any details about volume production or sample shipping dates for these eMCPs as yet.
