Sensing the requirement of high-resolution images,StMicroelectronics has released information of its roadmap for new 5M-pixel camera CMOS image sensors in the usual quarter-inch optical format used in camera-phone handsets. The new leading-edge sensors provide an alternative of features, thereby creating richest options of sensors at a 5-megapixel resolution.
The new sensors could boost flexibility for designers, with alternatives like raw Bayer or System-on-Chip (SoC) sensors, support for Extended Depth of Field (EDoF) or cameras with an on-chip autofocus driver, high-speed industry-standard data interfaces, and package technologies supporting usual camera assemblies, plus the most recent ultra-small wafer-level cameras.
Arnaud Laflaquiere, ST’s Sensor Business Unit Director, commented, “Our new 5-megapixel quarter-inch sensors are part of our strategy to build a complete and competitive EDoF sensor roadmap. Utilizing our most advanced 65/45nm pixel technology with unique techniques to maximize image quality, as well as packaging compatible with wafer-level camera assembly, enables us to deliver a wide range of innovative and attractive solutions at competitive system costs.â€
The roadmap will apparently carry on with new product introductions throughout the rest of 2009. The company’s 65/45nm pixel process supporting this family facilitates a pixel size of 1.4µm. Thereby letting 5-megapixel cameras within dimensions of 6.5mm x 6.5mm and a low module height of usually 5mm to facilitate ultra-low-profile handset designs. The sensors will also profit from ST’s exclusive pixel-isolation techniques, which maximize sensor’s Signal-to Noise Ratio (SNR) to offer best-in-class image quality.
Among the new devices to be launched, the quarter-inch Bayer sensors will permit the increase of pixel density in handsets where image processing is conducted by either the host system or with a stand-alone ISP. By also supplying a selection of SoC sensors, ST lets additional efficiency of camera-phones by inserting functions like the EDoF processor used to boost the camera’s depth of field. This saves designers executing auto-focusing capacity and also keeps the price and mechanical size in line with regular Fixed-Focus modules. Other sensors in the roadmap will provide functions where auto-focus is favored by incorporating a Voice Coil Motor (VCM) driver for the focusing mechanism.
The sensors will feature industry-standard parallel interfaces, facilitating straight link to the bulk of processors for cellphone applications. All the sensors will comprise of single-line or dual-line 1GHz Camera Serial Interface (CSI-2), as described by the Mobile Industry Processor Interface (MIPI) alliance and the 650Mbit/s Compact Camera Port (CCP2) interface described by the Standard Mobile Imaging Architecture (SMIA) group. It may result in advantages to compact form factor and support for high data rates encouraging high-speed image transfer.
ST will supply standard-die and Through-Silicon by means of (TSV) packaging in the 5M-pixel roadmap. The standard packaging will support cameras merging Chip-On-Board (COB) sensor connection and discrete optical components. TSV facilitates upcoming technologies like Wafer-Level Camera (WLC), which provides fully automated camera assembly at the wafer level, assures cost savings plus quality improvements in potential models of camera phones and other digital imaging products.
Production samples of the first of these sensors are available now. The availability of the final product is not known. The pricing is currently under wraps.
