SiliconBlue starts shipping high logic capacity FPGA
Designers can now easily implement feature-rich functions into mobile handsets with this latest offering. SiliconBlue has recently announced the immediate availability of two new device packages for its iCE65 MobileFPGA lineup. The iCE65L01 device with 1,280 logic cells is now delivered in a 5×5 mm, 81-ball BGA package with 63 user I/O pins. Whereas, the iCE65P04 device with 3,520 logic cells is now rendered in a 6×6 mm, 121-ball BGA package with 95 user I/O pins.
Nowadays, mobile phones are introduced at the drop of a hat. Every handset needs to be packed with multiple rich, powerful and enhanced features since the market is quite competent. However, application processors generally take about two to three years to develop. Such technological advancements may still lack the capability of including functions preferred by the designer.
“Our experience with the mobile handset market has taught us that in order to implement feature-rich functions, designers often need high logic capacity and maximum I/O, all in a small footprint package. These new devices, along with our wildly successful wafer-level chip scale packages are in demand for implementing a number of features including gyros, accelerometers, and dual displays,” shared Kapil Shankar, CEO of SiliconBlue.
Designers can utilize SiliconBlue’s iCE65 mobileFPGA devices in order to add novel features to the mobile handsets developed by them. Existing application processors of designers can be leveraged by the use of these latest offerings. The highly competitive mobile phone market can be aced with the use of these newly unveiled devices.
The iCE65L01F-TCB81 and the iCE65P04F-TCB121 are now available in mass production.
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