A-DATA to present XPG DRAM modules at Computex 2009
A-DATA Technology is all set to showcase its entire XPG – Xtreme Performance Gear product line-up and the latest XPG Series DRAM modules at the Computex Taipei 2009, which will be held between June 2, 2009 and June 6, 2009.
Following the success of the XPG Xtreme series DDR3-2133X v2.0 DRAM module, the company now plans to unveil the XPG Plus Series v2.0 and the Gaming Series v2.0 DRAM modules that support superior thermal conductive technology and characteristics heat sink design.
Talking about the XPG Plus Series v2.0 DRAM module, it is based on a new dual copper heat pipe design and claims to off-load the heat with extreme efficiency that further results in better stability and performance. The company states that all the memory chips are in direct contact with a thermo-conductive copper heat pipe, releasing the heat from the memory components. It has the ability to disperse the heat through the aluminum fin array.
Next is the XPG Gaming Series v2.0 DRAM module that implements extra surface area of heat sink to successfully dissipate heat through effective heat sink design.
In addition, both the DRAM modules carry double the amount of copper of PCB (printed circuit board), ensuring low temperature and better power efficiency from the critical areas of the module.
Other than that, the company will also display the latest XPG SX94 2.5-inch SATA II SSD with RAID 0 array. The product will be available in 256GB and 512GB storage capacities. This reliable SSD is capable of offering a reading speed of up to 230MB/sec and writing speed of up to 160MB/sec.
However, there is no clarity on the price and the availability of the A-DATA XPG DRAM modules.
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