Qualcomm sampling Dual-Carrier HSPA+ and Multi-Mode 3G/LTE Chipsets
In its dedicated pursuit of bringing advanced technologies to the global market, Qualcomm recently annunciated that it has moved towards sampling the industry’s claimed to be the first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. Apparently, the Mobile Data Modem MDM8220 solution is the foremost chipset to endure Dual-carrier High-Speed Packet Access Plus, while the MDM9200 and the MDM9600 are the industry’s first multi-mode 3G/Long Term Evolution solutions.
These chipsets significantly demonstrate valuable progress toward enabling the mass-market commercial deployment of two next-generation network technologies that ensure more advanced data capabilities to mobile devices concurrently. Dual-carrier HSPA+ and LTE are quite remarkable inventions in terms of network, delivering more advanced and ameliorated data capabilities to mobile phones, supporting more compelling applications and richer user experiences. Reflecting over the integration, Qualcomm is working with multiple network operators, infrastructure vendors and device manufacturers with its dual-carrier HSPA+ and LTE solutions.
“Qualcomm leads the industry in enabling next-generation mobile experiences with highly integrated, powerful and elegant solutions for dual-carrier HSPA+ and LTE. We are pleased to be working with so many industry leaders to bring these advanced technologies to market,” stated Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies. “We remain committed to CDMA and OFDMA WAN modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world.”
Qualcomm’s new MDM8220 dual-carrier HSPA+ solution, based on the 3GPP Release 8 standard, delivers peak downlink rates of up to 42 Mbps and 11 Mbps on the uplink. Such aggrandized speeds enable carriers to facilely upgrade their existent infrastructure equipment for achieving considerably higher bandwidths. Furthermore, its dual-carrier technology doubles network’s bandwidth from 5 MHz to 10 MHz by aggregating two HSPA carriers in parallel.
On the other hand, the efficient MDM9200 and the MDM9600 allow UMTS and CDMA2000 operators to upgrade seamlessly to future LTE services while preserving compatibility to their current 3G networks. MDM9200 lends support to UMTS, HSPA+ and LTE, while the MDM9600 supports CDMA2000 1X, EV-DO Rev. B, SV-DO, SV-LTE, UMTS, HSPA+ and LTE. All of the new chipsets support FDD LTE and TDD LTE modes and different carrier bandwidths, and are capable of using orthogonal frequency division multiple access and multiple-input and multiple-output antenna technology to support peak data rates of up to 100 Mbps on the downlink and 50 Mbps on the uplink.
Several network operators, infrastructure vendors and mobile device manufacturers are now working with Qualcomm to enable the deployment of these next-generation network technologies in new markets across the globe. Commercial launches of data-centric devices based on Qualcomm’s MDM solutions are anticipated to commence
during the second half of 2010.
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