VIA Technologies intros Mobile-ITX for portable embedded devices
Addressing the rising needs of compact and portable devices, VIA Technologies introduced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices. The compact 6cm x 6cm computer-on-module specification is designed especially for ultra-compact and lightweight devices that provide a wide range of connectivity options and a rich, flexible feature set.
The latest Mobile-ITX is said to be 50 percent smaller than the previous Pico-ITX form factor. The CPU module I/O signals are mapped to two high density, low profile connectors on the under side of the module, and the distance between the CPU module and the baseboard is barely 3mm, perfect for ultra-slim system designs. Further, the connectors can also withstand vibrations of up to 5Gs, suitable for in-vehicle and industrial machining applications.
“With Mobile-ITX we have again pushed back the barriers that limit just how small an embedded industrial PC can be. Mobile-ITX enables the creation of a new breed of ultra-compact, portable networked devices suitable for a range of applications, particularly in modern medical and military segments,” mentioned Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc.
CPU modules based on the Mobile-ITX form factor assimilate core CPU, chipset and memory functionality and I/O inclusive of the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, and also PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, via customizable baseboards.
The VIA Embedded Platform Division will announce the first commercial CPU module based on the Mobile-ITX form factor by Q1 2010.
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